Heavy Duty Phosphor Bronze Mesh For Papermaking Customized Service

Phosphor Bronze Wire Cloth For Papermaking

Product Description

Bronze has a higher corrosion resistance, abrasion resistance, maximum working temperature of 250 ℃, bronze is an alloy of copper, with good electrical properties, easy to heat, to ensure safety at the same time have a strong fatigue resistance, excellent mechanical processing performance, widely used in copper casting, solder and other fields.

Phosphor bronze wire mesh is frequently used in sieving diversified pellet, powder, porcelain clay and glass, chinaware printing, filtering liquid and gas.We are capable of supplying brass wire mesh from 1-200mesh, and phosphor bronze wire mesh from 1-500mesh.Width from 0.6m to 1.3m, length from 15m to 100m.Phosphor bronze wire mesh is an alloy of copper with 3.5 to 10% of tin, with a significant phosphorus content of up to 1%.

Phosphor bronze is well regarded for it's strength and toughness compared to the natural copper. This is due to the levels of tin in the alloy.Woven wire mesh and wire cloth made of phosphor bronze wire are mainlyused as fine wire cloth in a number of industries.Phosphor bronze wire mesh is frequently used in sieving diversified pellet, powder, porcelain clay and glass, chinaware printing, filtering liquid and gas.

Feature of the Phosphor Bronze Wire

· Good electrical conductivity.
· Heat transfer performance.
· Corrosion Resistant and Non-magnetic.
· Abrasion resistance and ​Low ductility.
· Acid and Alkali Resistant.
· High Air Pemeability.
· Easy Clean Ability.

· Corrosion-resistant.

Application of the Phosphor Bronze Wire

1. Industrial applications
Shipping: As good seawater corrosion resistance.
Cars: Mainly used radiator, brake system piping, fittings and accessories, such as.
Railway: motors, electrical and signal systems on the train.
Aircraft: aircraft wiring, hydraulic, cooling and pneumatic systems need to use copper
2. Electronic applications
Electronical vacuum devices: HF and UHF launch tube, waveguide, magnetron, etc, which require high-purity oxygen-free copper and oxygen-free copper dispersion strengthened
Printed circuit: used for the circuit connection.
3. IC: microchip.
Lead Frame: it has become an important material for the lead frame.

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